Together, they will form the active ("on/off") part of the chip's circuitry plus the connections between them in a three-dimensional structure. Many layers are deposited across the wafer and then removed in small areas to create transistors and interconnects. Intel uses a photolithographic "printing" process to build a chip layer by layer. Now the company uses 12-inch or 300-millimeter (mm) wafers larger wafers are more difficult to process, but the result is lower cost per chip. When Intel first started making chips, the company used 2-inch diameter wafers. Intel fabs are among the most technically advanced manufacturing facilities in the world. The factories where chips are made are called fabrication facilities, or fabs. The process of making computer chips is called fabrication.
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